Imbera: The company has developed a patented method for embedding passive and active components into PCB substrate. The technology has proven benfits in certain high volume applications through miniaturisation and improved dialectrics.

Website:

http://www.imbera.biz

HQ:

Helsinki, Finland

CEO:

Jeff Balloun

Co-investors:

Conor Venture Partners, Index Ventures, Daeduck

Northzone contact:

Bjørn Stray